The Tokyo Electric Power Company, Incorporated (the "Company") hereby notifies all interested 
parties that the Company has decided the following outline of issuance of its 554th and 555th 
domestic straight corporate bond. The terms of the issues are as follows:

[Outline of Issue]
1. The Tokyo Electric Power Company, Incorporated's 554th Domestic Straight Corporate Bond
(1)  Name of the bond           The Tokyo Electric Power Company, Incorporated 
                                554th Domestic Straight Corporate Bond
                                 (with general mortgage)
(2)  Aggregate amount           30 billion yen
(3)  Date of issue              May 29, 2009 
(4)  Coupon rate                1.608 % 
(5)  Issue price                100 yen per par value of 100 yen
(6)  Mortgage                   General Mortgage
(7)  Interest payment date      May 29 and November 29 every year 
(8)  Redemption date            May 29, 2019 
                                 (10-year period: bullet maturity)
(9)  Yield on the bond          1.608 %
(10) Denomination value         1 million yen
(11) Schedule
     Announcement date          May 14, 2009 (Thursday) 
     Offering period            May 14, 2009 (Thursday) 
     Payment due date           May 29, 2009 (Friday) 
(12) Lead managing underwriter
                                Nomura Securities Co., Ltd. 
                                Mizuho Securities Co., Ltd. 
                                Daiwa Securities SMBC Co. Ltd. 
                                Nikko Citigroup Limited 
                                Merrill Lynch Japan Securities Co., Ltd. 

2. The Tokyo Electric Power Company, Incorporated's 555th Domestic Straight Corporate Bond
(1)  Name of the bond           The Tokyo Electric Power Company, Incorporated 
                                555th Domestic Straight Corporate Bond
                                 (with general mortgage)
(2)  Aggregate amount           30 billion yen
(3)  Date of issue              May 29, 2009 
(4)  Coupon rate                1.113 % 
(5)  Issue price                100 yen per par value of 100 yen
(6)  Mortgage                   General Mortgage
(7)  Interest payment date      May 29 and November 29 every year 
(8)  Redemption date            May 29, 2015
                                 (6-year period: bullet maturity)
(9)  Yield on the bond          1.113 % 
(10) Denomination value         1 million yen
(11) Schedule
     Announcement date          May 14, 2009 (Thursday) 
     Offering period            May 14, 2009 (Thursday) 
     Payment due date           May 29, 2009 (Friday) 
(12) Lead managing underwriter
                                Daiwa Securities SMBC Co. Ltd. 
                                Nikko Citigroup Limited 
                                Shinkin Securities Co., Ltd. 
                                Nomura Securities Co., Ltd. 
                                Mizuho Securities Co., Ltd. 


Please note that the above purports to be an accurate and complete translation of the original 
Japanese version prepared for the convenience of our English-speaking audience. However, in the 
case of any discrepancy between the translation and the Japanese original, the latter shall prevail.